Y2 Project Week 1

General ideas:

Our group aims to build a sound monitoring system which is able to detecting the sound level in a room. The whole design is based on the micro controller called Arduino Yun. As for the principle, the sound monitoring system is able to detect by a microphone, then amplify the signal and convert it into digital signal. Finally, display the sound level on the smart phone through bluetooth.

Component:

1. Arduino Yun
2. Microphone
3. Amplifier OPA335AID
4. Chip LOG112
5. Differential Amplifier INA133
6. Bluetooth

Description of Several components:

1. Microphone
The microphone can detect the noise signal in a specific range. Therefore, the filter is not necessary in the sound monitoring system.

2. Amplifier OPA335AID
The component is able to amplify the signal stably. Moreover, the cost is relatively low. The schematic of it is shown below.


Figure 1. The Schematic of Amplifier OPA335AID
3. Chip LOG112
The chip has high accuracy with low power consumption. Furthermore, the signal operated can be a core factor is the next component. The schematic of the chip is shown as below.

                                                      

Figure 2. The Schematic of Chip LOG112

4. Differential Amplifier INA133
The chip INA133 has 2 port input and 1 port output. The error of gain is very small so that the chip INA133 will be applied in the sound monitoring system. The schematic of the component is shown below.



                                                    
Figure 3. The Schematic of Differential Amplifier INA113

Experience of the Experiment:

Unfortunately, the group has to give up the original idea since the size of components are very small. In order to build the sound monitoring system, we need a specific PCB board and a good skill of soldering, which we can not handle it. The PCB board can not be found or built. Hence, we find an alternative idea to build the sound monitoring system. The diagram comparing the size of previous components and 5 penny is shown below.


Figure 4. The Comparison of Size of Components and 5 penny

Conclusion:
The original idea of sound monitoring system is too difficult for us to build it owing to the needs of PCB board and skill of soldering. Therefore, the group has to consider a new proposal of building the sound monitoring system. In the next week, we aim to prepare all the components with relatively large size that can be soldered on the ordinary breadboard. After that, we will design and connect the circuit of sound monitoring system. Apart from that, testing will be held in the next week if we have spared time. Therefore, the part of hardware will be completed mostly in the next week.

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